ADI晶圆化合物半导体材料

发布时间:2021-03-18 17:13:47     浏览:1797

ADI晶圆的制取包括衬底制取和外延性工艺。衬底是由半导体材料单晶材料制作而成的晶片。该基板可直接进入晶圆制造流程以生产制造半导体元器件或外延性晶圆。外延性是指在单晶衬底上生长一层新单晶的流程。ADI新的单晶能够是与衬底相同的材料,还可以是有所不同的材料。外延性能够产生越来越多种类的材料,使元器件设计有越来越多的选择。

衬底制取的基础步骤如下:首先,对半导体材料多晶材料进行提炼、掺杂和拉伸,获得单晶材料。以硅为例子,先将硅砂精炼、复原为纯度98%左右的冶金工业级粗硅,再通过多次提炼,获得电子级高纯度多晶硅,再经炉拉获得单晶硅棒。通过机械加工、化学处理、表面抛光和质量检测,获得了满足一定标准的单晶抛光片。抛光的目的是更进一步去除加工表面上的残余损伤层。综上所述抛光片可直接适用于制造元器件,也可用作外延性的衬底材料。

深圳市立维创展科技有限公司,优势渠道提供ADI晶圆产品华夫格,专业通道,欢迎合作。

详情了解ADI Wafer产品请点击: http    //www.ldteq.com/public/brand/68.html

或联系我们的销售工程师:  0755-   83642657      QQ    2295048674  

 ADI芯片.jpg

Generic

Material

Description

Order Qty

Package Option

Category

ADA4841-2

ADA4841-2KGD-WP

Dual Low Power Low Noise Rail-Rail OpAmp

Contact ADI

WAFFLEPACK

Amplifiers

ADA4870

ADA4870-KGD-WP

Single Channel High Speed, 1A Output

Contact ADI

WAFFLEPACK

Amplifiers

ADA4870

ADA4870-KGD-DF

Single Channel High Speed, 1A Output

Contact ADI

FILMFRAME

Amplifiers

ADN2820

ADN2820ACHIPS

10Gbps Tranimpedance Amplifier

Contact ADI

WAFFLEPACK

Amplifiers

ADN2880

ADN2880ACHIPS

2.7Gbps Transimpedance Amplifier IC.

Contact ADI

WAFFLEPACK

Amplifiers

OP27

OP27NBC

9/30V, BIP, OP, Low Noise, Low Dr

Contact ADI

WAFFLEPACK

Amplifiers

OP284

OP284CHIPS

3/30V, BIP, OP, Low Noise, RRIO, 2X

Contact ADI

WAFFLEPACK

Amplifiers

OP37

OP37NBC

9/30V, BIP, OP, Low Noise, Avo >-5, 1X

Contact ADI

WAFFLEPACK

Amplifiers

OP37

OP37-001C

9/30V, BIP, OP, Low Noise, Avo >-5, 1X

Contact ADI

FILMFRAME

Amplifiers

OP400

OP400GBC

6/30V, BIP, OP, Low Vos, Low Isy, 4X

Contact ADI

WAFFLEPACK

Amplifiers

OP42

OP42NBC

Fast Settling Precision op amp

Contact ADI

WAFFLEPACK

Amplifiers

OP467

OP467GBC

Quad Precision, High Speed Op Amp

Contact ADI

WAFFLEPACK

Amplifiers

OP77

OP77NBC

6/30V, BIP, OP, Low Vos, Precision, 1X

Contact ADI

WAFFLEPACK

Amplifiers

OP77

OP77-001C

6/30V, BIP, OP, Low Vos, Precision, 1X

Contact ADI

FILMFRAME

Amplifiers

HMC-ALH102G

HMC-ALH102

GaAs HEMT WBand lo Noise amp, 2 - 20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC-ALH102G

HMC-ALH102-SX

GaAs HEMT WBand lo Noise amp, 2 - 20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC-ALH482G

HMC-ALH482

GaAs HEMT WBand lo Noise amp, 2 - 22 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC-ALH482G

HMC-ALH482-SX

GaAs HEMT WBand lo Noise amp, 2 - 22 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC-AUH232G

HMC-AUH232

GaAs HEMT WBand Driver amp, DC - 43 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC-AUH249G

HMC-AUH249

GaAs HEMT WBand Driver amp, DC - 35 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC-AUH312G

HMC-AUH312

GaAs HEMT WBand Driver amp, DC - 65 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC460G

HMC460

WBand lo Noise amp Chip, DC - 20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC460G

HMC460-SX

amp, lo Noise, DC-20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC462G

HMC462

low Noise amp Chip, 2 - 20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC462G

HMC462-SX

I.C., 2-20 GHz WBand LNA Die

Contact ADI

GEL_PACK

Amplifiers

HMC463G

HMC463

low Noise amp Chip w/AGC, 2-20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC463G

HMC463-SX

I.C., 2-20GHz LNA Die

Contact ADI

GEL_PACK

Amplifiers

HMC465G

HMC465

WBand Driver amp Chip, DC - 20 GHz

Contact ADI

GEL_PACK

Amplifiers

HMC465G

HMC465-SX

I.C., DC-20GHz PA Die

Contact ADI

GEL_PACK

Amplifiers

HMC562G

HMC562

WBand Driver amp Chip, 2 - 35 GHz

Contact ADI

GEL_PACK

Amplifiers


推荐资讯

  • IR HiRel集成电路隔离工业接口
    IR HiRel集成电路隔离工业接口 2022-01-14 17:17:04

    IR HiRel的ISOFACE™具备集成隔离作用的高可靠性工业生产接口IC,安全可靠性提升5倍,工业生产自动化系统发布产品时长缩减50%。等高线™为诊断作用设定了新标准,以最大限度地减少计划外停机时长。充分利用IR HiRel隔离工业生产接口IC解决方案。

  • RT/duroid® 5880层压板Rogers
    RT/duroid® 5880层压板Rogers 2023-05-18 16:46:11

    Rogers​ RT/duroid®5880高频层压板是微纤维增强的PTFE复合板材。RT/duroid®5880层压板具备低介电常数(Dk)和低损耗的特性,特别适合高频率/宽带网络技术应用。

在线留言

在线留言